Fabrication and thermo-physical properties of TiB2p/Cu composites for electronic packaging applications

CHENGuo-qin(陈国钦),XIUZi-yang(修子扬),MENGSong-he(孟松鹤),WUGao-hui(武高辉),ZHUDe-zhi(朱德志)

Transactions of Nonferrous Metals Society of China ›› 2009, Vol. 19 ›› Issue (Special 2) : 448-452.

The Nonferrous Metals Society of China
Transactions of Nonferrous Metals Society of China ›› 2009, Vol. 19 ›› Issue (Special 2) : 448-452.
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Fabrication and thermo-physical properties of TiB2p/Cu composites for electronic packaging applications

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2009, 19(Special 2): 448-452

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